Levus Y. Methods and tools of thermal design of Flip-Chip devices

Українська версія

Thesis for the degree of Candidate of Sciences (CSc)

State registration number

0403U000715

Thesis Registration Form

0403U000715.pdf

Applicant for

Specialization

  • 05.13.12 - Системи автоматизації проектувальних робіт

24-01-2003

Specialized Academic Board

Д 35.052.05

Lviv Polytechnic National University

Essay

The important task of increasing effectiveness of thermal design of flip chip devices was accomplished in this dissertation by creating and developing mathematic models, methods and algorithms for temperature analysis. The system of thermal design of flip chip devices developed by the author provides an effective solution for topical tasks of thermal design: three-dimensional thermal analysis and development of recommendations for providing the necessary temperature performance.

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Files

LEVUS.DOC

aref.doc

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