Hovorun T. Size effect in electrophysical properties of the Сu, Ni and Co films with thin metal or dielectric overlayer

Українська версія

Thesis for the degree of Candidate of Sciences (CSc)

State registration number

0409U004298

Thesis Registration Form

0409U004298.pdf

Applicant for

Specialization

  • 01.04.07 - Фізика твердого тіла

03-07-2009

Specialized Academic Board

Д 55.051.02

Sumy State University

Essay

The dissertation work is devoted to theoretical and experimental research of size ef-fects in electrophysical properties and parameters of electrical transfer, features of the structurally-phase state, diffusive processes in the Cu, Co (Ni) films with thin overlayer Ni (Cu) or SiO2. It is set that due to causing of thin metallic overlayer and conducting thermal annealing, the size of temperature coefficient of resistance of tapes of bases diminishes to 20%, that is conditioned the change of terms of dispersion on external and internal boundary. That the specularity parameter in all cases, except for Cu films with thin overlayer SiO2, goes from bad to worse.

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Files

Avtoref_Hovorun1 .pdf

Disertacja_Hovorun1.pdf

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