Fedasyuk D. Сomputer aided thermal design of the microelectronics systems

Українська версія

Thesis for the degree of Doctor of Science (DSc)

State registration number

0500U000217

Applicant for

Specialization

  • 05.13.12 - Системи автоматизації проектувальних робіт

27-06-2000

Specialized Academic Board

Д 35.052.05

Lviv Polytechnic National University

Essay

Research object – heat removal process in microelectronics systems. Aim – development of the models and methods for thermal design of the microelectronic devices of different structure. Researches methods: apparat of computing mathematics and mathematical physics, applied and system programming. Theoretical result – the models and methods of the thermal analysis for microelectronic devices of the different structure. Practical result - the algorithms and software for systems of computer technology for thermal design, expand the functional capabilities of existing CAD. Economic effect – economy material and power resources in act of design and manufactured of the microelectronics. Spheres uses – enterprise and scientific establishments, which attend to design and production ІС, high education.

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