Iefimenko A. Methods and models of synthesis and optimization of interblock electrical connections for radio engineering devices and telecommunication equipment

The author of the thesis solves an important scientific and applied problem of improving the efficiency of designing interblock electrical connections for radio engineering devices and telecommunication equipment (REDTE) in further development of the design theory by developing models and synthesizing and optimizing methods. These models and methods make it possible to create a scientific and practical basis to improve design efficiency, enhance automation capability in order to reduce design time and design complexity while improving quality and reliability of products, and reduce costs on the technical preparation of production and on production of electrical connections and mechanical structures. Also developed are methods of selecting the optimal design of electrical connections and mechanical structures for REDTE. The problem of improving the performance and efficiency of REDTEs is solved by the development of methods and models for the synthesis of elements of the electrical connections and MS design methods, as well as by developing new methods for solderless contact connections. Proposed for the first time are the methods of foil puncture and pressing using flexible printed cables and elastomeric inserts to perform solderless contact connections on the PCB surface. A method is presented for researching mechanical strength of wired electrical connections - for this purpose the impact is established between the connection characteristics and the signal it transmits, under the influence of mechanical factors. The following methods are modernized: increase of the reliability of wired connections, of rational use of specialized materials, ensuring interchangeability of MS elements, automated coating selection, execution of design documentation for printed circuit boards using computer-aided design, taking into account the influence of parasitic elements of backplanes on the functional properties of electronic modules.