Lyapina O. Physical-chemical processes on surface of copper alloy film.

The work contains the experimental researches and theoretical substantiation of formation laws of the condensed systems at evaporation of alloys on the basis of copper, and also the analysis of processes on a surface of condensates at its interaction with various hostile environments. Accounting methods of half-quantitative estimation of kinetics of fractioning of binary and threefold system at its evaporation in vacuum is offered, and also the estimations of components distribution on thickness of covering at evaporation of final hinges of alloys. It is shown, that physical and chemical properties of condensates surface are determined by structure of initial hinge and it is established that among systems Cu-Sn, Cu-Sn-Al and Cu-Sn-Ni the maximal thermodynamic stability have the following alloys with contents of tin 38…45 % (Cu-Sn) and 25…55 % (Cu-Sn-Ni and Cu-Sn-Al). Concentration dependences of electrode potentials and Rп polarizing resistance near to corrosion potentials were received and analyzed.It is established, that values of ? are essentially more positive for the average range of structures. Maximal values of Rп correspond the average range of structures. Data processing of potential-dynamic researches has allowed defining, systematizing and tabulating the key parameters of electrochemical corrosion of the investigated systems in neutral, sour and alkaline environments. Recommendations on application of the data received by development of the quantitative theory of anticorrosive alloying are given.