Tarashchanskii M. Heightening of accuracy ID saw cutting semiconductor monocrystals due to reduction of non-uniformity of a tension of the case of a detachable circle.

Object of research - accuracy of cutting of monocrystals with ID saw cutting which is fixed and will stretch in the device of a tension. The purpose of research - increase of accuracy of cutting of ingots of semi-conductor monocrystals by ID saw cutting due to reduction of non-uniformity of a tension of the tool. Methods of researches: theoretical on bases of positions of the theory of elasticity, the theory of fluctuations and durabilities of elements and units of designs, experimental with use of methods of mathematical statistics. Analytical dependence for definition of size of a deflection of the cut off plate is offered. Methods of definition of non-uniformity of a tension of a detachable circle, and also a technique of a choice of maximum permissible size of a tension of a detachable circle in view of influence of forces of cutting are developed. The technique of reduction of size of non-uniformity of a tension of a detachable circle is introduced in manufacture. Results of researches can be usedin conditions of sites of cutting of ingots of semi-conductor materials at manufacturing wafers.