Koman B. Patterns of interfacial interaction in the surface layers of structures based on Si and CdxHg1-xTe

The dissertation first obtained holistic and integrated results for Set-added interfacial interaction patterns in the surface layers of structures "silicon - metal (Cu, Al, Cr, Au)", "graphene - (Si, Cu, Fe, Co, Au, Ag, Al, Ru, Hf, Pb)" and "semiconductor (Si, Ge) - (Fe, Co, Cu, Al, Au, Cr, W, Pb)", having interphase boundaries. Reviewed interfacial interaction energy parameters: the energy of interfacial interaction, interfacial tension, the work of adhesion energy adheziy ties and traced their behavior at phase transitions in the lining and metals. For systems "silicon-metal condensates (Cu, Al, Cr, Au)", obtained new results-field hayut role in establishing self-organizing silicon substrate, providing the same conditions spreading nanodispersed metal condensate (for metals with ?X < 0,4). The analysis of behavior and adhesion energy options can be used to select when creating pairs of contacting thermodynamically stable structures with specific values of interfacial interaction energy parameters, given the type of chemical bond and the optimum level of mechanical stress.