Petrashchuk S. Providing strength in thermal impacting electronic components sealed with compound

Objects are electronic components sealed with compound and having revolution shape; aim is to protect electronic components from compound and to develop methods for calculation and measuring mechanical stress; methods are method of elasticity theory, mathematical and physical methods, electrotensometry; the new approach lies in creation of mathematical model for calculation of mechanical stress in electronic component - compound system under thermal impact; the main results include mathematical model for calculation of mechanical stress in electronic component - compound system, solving problem of non-stationary heat conductivity of sealed unit and component, method for identification of physical and mechanical characteristics, technological methods for protection of electronic components; technological methods have been implemented by electronic enterprise; the field is materials and electronic components and technology