Dyachok D. Constructive-technological methods of increasing electrical conduction in micro contacted connections of integrated circuits

The dissertation describes the results of mathematical modeling of resistances in weld-plated MCC of micro wire, pellicle conductor, hard pillar MCC and transitional micro wire links between the inside and outside of IC. The mathematical model allows withdrawal to determine components of resistances and characteristics of transitional link. The modeling suggests constructive-technological methods that increase the electrical conduction in MCC. New methods of measuring resistance levels of micro contacted connections are outlined. The influence of transitional contacted resistances on the measuring probe is eliminated. Hence, the measurement accuracy is improved. New methods of manufacturing highly transitional MCC elements are proposed.