Mukha T. Applied software for simulation of heat dissipation process due to boiling and evaporation in electronic devices

The important scientific problem of mathematical and software support development for computer analysis of heat transfer processes into microelectronic devices (MED) elements using liquid evaporation and boiling for heat dissipation intensification under critical conditions has been solved. The mathematical models of heat transfer with cooling due to liquid evaporation and boiling under critical conditions into electronic devices have been built, the methods of thermal field analysis have been developed. The applied software for problems solving automation of heat transfer processes transient analysis into MED using liquid evaporation and boiling.