The thesis is aimed at the development of scientific and practical principles of construction and research of functionally integrated sensors of thermal analysis on the basis of solid - state microelectronic components and multifunctional signal converters. Considering the dynamics of thermal analysis sensors’ development that are widely used in the fields of materials science, physics, biophysics, medicine, there is a need to create new functionally integrated, complete analogue front-end devices with Internet of Things support. New approaches to the construction of microelectronic sensors of thermal analysis based on structures of solid-state electronics (in particular transistor ones) have been developed. The novelty is the functional integration – the usage of a single microelectronic structure of a converter for the controlled heating of the sample or medium, according to the given algorithm of modulation of a heat flow, the measurement of temperature or temperature difference between the sample and the reference, as well as measurement of changes in magnetic, mechanical, optical and impedance characteristics of the sample during its temperature modulation.
The further development of the method of thermal analogy is proposed for the synthesis of substitution schemes of SPICE models of thermal analysis sensors, whose informative quantities are the temperature of phase transitions (melting, glass transition, crystallization, etc.) of the investigated substance and the amount of thermal energy that is absorbed or released during such transition. The method is implemented on a new universal SPICE component - Thermicap, which simulates the phase transition of the investigated substance with the possibility of thermal energy accumulation. The criteria of accuracy estimation of differential temperature sensors’ functioning on transistor cascades are established on the basis of minimization of a linear approximation error, and methods of optimization of an operation mode of such sensors are developed. For the first time, the structure of a functionally integrated temperature sensor, based on organic light-emitting and photosensitive materials, is synthesized. It combines a radiation source, an optically active medium and a radiation detector, and is characterized by high temperature sensitivity (30 nm/°С).
New functionally integrated thermal analysis sensors that combine the research of thermal and magnetic or mechanical properties of the investigated objects have been developed. The devices are characterized by high values of the resolution of temperature difference measurement (less than 0,001C), and meet the criteria and requirements of microelectronic devices of the Internet of Things: unipolar low-voltage power supply, minimum energy consumption, functioning in a wide range of input and output voltages (rail-to-rail modes), versatility and stability of operation while changing the external influences.
