Kudryk Y. Effect of active actions on the formation processes and properties of ohmic and barrier contacts to silicon carbide.

Українська версія

Thesis for the degree of Candidate of Sciences (CSc)

State registration number

0405U000374

Applicant for

Specialization

  • 05.27.06 - Технологія, обладнання та виробництво електронної техніки

21-01-2005

Specialized Academic Board

К 26.199.01

Essay

The thesis deals with investigation of processes occurring at metal/silicon carbide interface exposed to active treatments. It is determined that amorphous and quasi-amorphous TiBx (ZrBx) films exposed to rapid thermal annealing (RTA) up to a temperature of 1000 °C do not exhibit structure and phase transitions. The Schottky barrier structures on their basis are tolerant to RTA up to a temperature of 1000 °C and to 60Co (-irradiation (doses up to 109 R). Along with thermal treatments, non-thermal ones were also applied to form ohmic contact to SiC with contact resistance. It is determined that resistivity and thermal stability of contacts formed with non-thermal treatments are the same as those obtained at thermal formation.

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