Demska N. Technology of electrical interconnections of electronic equipment modules

The object – the technological process of forming electrical interconnections of electronic equipment modules. The goal is to improve the quality of high-density detachable and non-detachable electrical interconnections in multilayer flexible commutative structures for electronic equipment modules by developing technology for the formation of these connections based on studies of physical and technological parameters of flexible commutative structures. Methods – finite element methods and solving differential equations, theories of elasticity and fracture of solids, mathematical and computer modelling, regression analysis and the theory of factorial experiment, queuing theory, methods of experimental research. Results – the method of calculating the stiffness matrix of finite elements with a known vector of external forces has been further developed, which allows to calculate the deformations of elastic elements of interconnections, in order to ensure the mechanical strength of interconnections and ultrathin electronic components; the technology of electrical switching elements was further developed, which allowed to develop the design of a flat connector for electronic devices with zero insertion force with pneumatic pressing of contact elements, which differs from analogues: less likely to cause defects, increased contact density and number of pins; for the first time, a multifactor experiment was used to get the influence model of the design parameters of a flat connector on the transient resistance that occurs between the connector and the loop, which allowed to optimize the design of the connector by minimizing the transient resistance; the mathematical model of the technological process of assembling electronic equipment modules has been improved based on aluminum-polyimide flexible commutative structures was proposed, which allows to evaluate the reliability and stability of the technological process, determine the percentage of suitable products, average manufacturing time of one product, average number of assembled products. Scope – electronics industries.